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BGA Solder Ball

BGA Solder Ball

Environmentally Friendly Lead-Free With Different Sizes BGA Solder Balls For Computer Motherboard Repair And PCB WeldingEnvironmentally Friendly Lead-Free With Different Sizes BGA Solder Balls For Computer Motherboard Repair And PCB Welding
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Environmentally Friendly Lead-Free With Different Sizes BGA Solder Balls For Computer Motherboard Repair And PCB Welding

2024-10-17

BGA Solder/Tin ball is a small spherical object mainly made of tin. In industrial applications, BGA Solder balls are mainly used as welding materials for electronic components. Widely used in computer motherboard maintenance, various chip welding with PCB and so on. Due to its good heat conduction, the solder ball can ensure the quality and stability of the welding, and provide a stable physical support and electrical connection for the chip and the circuit board. Especially in BGA mount technology, solder ball as a welding material, can improve the efficiency, quality and productivity of electronic products, while having good heat dissipation, improve electronic properties.

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