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Environmentally Friendly Lead-Free With Different Sizes BGA Solder Balls For Computer Motherboard Repair And PCB Welding
Product Information
Product Name: Solder Ball
Main Material: Tin
Color: Silver
Size: Customized Support
Main Function: Welding Chip and circuit board
Range Of Application: Computer Motherboard Repair, PCB Circuit Board, Chip etc
Packaging: Plastic Bottle Or Carrier Tapes
Features Of BGA Solder Ball
1. Strong adaptability: Suitable for a variety of welding processes and compatible with different types of circuit boards and components.
2. Low melting point: The melting point of solder balls is relatively low, which facilitates soldering at lower temperatures and reduces damage to components.
3. Good fluidity: After heating, the solder ball can flow well and form a good solder point.
4. Oxidation resistance: Improve the service life of BGA solder ball and welding strength.
Function Of BGA Solder Ball
1. Electronic component welding: Widely used for welding various electronic components, such as chips, integrated circuits etc.
2. Ball Grid Array (BGA): BGA solder balls are used to connect surface mount components to the circuit board.
3. Repair and rework: Solder balls can be used in the repair and rework of electronic products to facilitate the replacement of fault components.
All in all,Solder balls play an important role in modern electronic manufacturing, ensuring the reliability and performance of electronic devices.
About Customized Service
We are a professional manufacturer, provide OEM Service. We could produce different sizes of BGA solder balls as per your needs to adapt various circuit board. If you are interested in our products or have customized requirements, kindly please contact us!