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Lead-Free BGA Solder Balls for PCB Repair, Different Sizes from China Suppliers and Factory
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Lead-Free BGA Solder Balls for PCB Repair, Different Sizes from China Suppliers and Factory

BGA Solder/Tin Balls are essential components in the electronics manufacturing industry, primarily composed of high-quality tin. These small spherical objects are widely utilized as welding materials for electronic components, particularly in China, where leading suppliers and factories produce them for various applications. BGA Solder Balls play a crucial role in computer motherboard maintenance and chip welding with PCBs. Their excellent thermal conductivity ensures optimal quality and stability in soldering processes, providing reliable physical support and electrical connections between chips and circuit boards. When used in BGA mounting technology, these solder balls enhance the efficiency, quality, and productivity of electronic products, all while offering superior heat dissipation and improved electronic properties. Trust the top suppliers and factories in China for your BGA solder needs to ensure the best performance in your electronic devices

    Product Information
    Product Name Solder Ball
    Main Material Tin
    Color Silver
    Size Customized Support
    Main Function Welding Chip and Circuit Board
    Range Of Application Computer Motherboard Repair, PCB Circuit Board, Chip etc.
    Packaging Plastic Bottle Or Carrier Tapes
    Features Of BGA Solder Ball
    • 🔧 Strong Adaptability: Suitable for a variety of welding processes and compatible with different types of circuit boards and components.
    • 🌡️ Low Melting Point: The melting point of solder balls is relatively low, which facilitates soldering at lower temperatures and reduces damage to components.
    • 💧 Good Fluidity: After heating, the solder ball can flow well and form a good solder point.
    • 🛡️ Oxidation Resistance: Improve the service life of BGA solder ball and welding strength.
    Function Of BGA Solder Ball
    • Electronic Component Welding: Widely used for welding various electronic components, such as chips, integrated circuits etc.
    • 🔲 Ball Grid Array (BGA): BGA solder balls are used to connect surface mount components to the circuit board.
    • 🔄 Repair and Rework: Solder balls can be used in the repair and rework of electronic products to facilitate the replacement of fault components.
    💡 All in all, Solder balls play an important role in modern electronic manufacturing, ensuring the reliability and performance of electronic devices.
    About Customized Service
    🏭 We are a professional manufacturer, provide OEM Service. We could produce different sizes of BGA solder balls as per your needs to adapt various circuit board. If you are interested in our products or have customized requirements, kindly please contact us!
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    Frequently Asked Questions
    Q What is a BGA solder ball made of?
    BGA solder balls are primarily made of tin (Sn), often alloyed with other metals such as silver (Ag) or copper (Cu) to enhance performance. They appear silver in color and are designed for precision electronic assembly.
    Q What sizes of BGA solder balls are available?
    We support customized sizes to meet different circuit board and component requirements. Please contact us with your specific size needs and we will provide a tailored solution.
    Q What are the main applications of BGA solder balls?
    BGA solder balls are widely used in computer motherboard repair, PCB circuit board assembly, chip mounting, integrated circuit welding, and electronic product repair and rework processes.
    Q How are BGA solder balls packaged?
    Our BGA solder balls are available in two packaging options: plastic bottles or carrier tapes, depending on your usage requirements and quantity. Custom packaging can also be arranged upon request.
    Q Do you offer OEM or customized manufacturing services?
    Yes, we are a professional manufacturer offering full OEM services. We can produce BGA solder balls in various sizes and specifications based on your requirements to adapt to different circuit boards and applications.
    Q Why choose BGA solder balls with low melting point?
    A low melting point allows soldering to be performed at lower temperatures, which significantly reduces the risk of heat damage to sensitive electronic components, improving overall assembly quality and component longevity.

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